The influence of polydimethylsiloxane curing ratio on capillary pressure in microfluidic devices

Applied Surface Science

Volumn 258, Issue 20, 2012, Pages 8032-8039

  Viola, Ilenia ^a,b   Zacheo, Antonella ^a,c   Arima, Valentina ^a   Aricò, Antonino S ^d   Cortese, Barbara ^a   Manca, Michele ^a,e   Zocco, Anna ^f   Taurino, Antonietta ^g   Rinaldi, Ross ^a,c   Gigli, Giuseppe ^a,c,e  

^a NATIONAL NANOTECHNOLOGY LABORATORY   (Italy)

^b SAPIENZA UNIVERSITY OF ROME   (Italy)

^c UNIVERSITY OF SALENTO   (Italy)

^d CNR ITAE   (Italy)

^e ISTITUTO ITALIANO DI TECNOLOGIA   (Italy)

^f STMICROELECTRONICS   (Italy)

^g CNR   (Italy)

Author keywords

Capillary pressure; Lab on chip; Microfluidics; PDMS; Wettability; XPS

Indexed keywords

ATOMIC FORCE MICROSCOPY; CAPILLARITY; CAPILLARY TUBES; CONTAMINATION; CURING; FLUIDIC DEVICES; LIQUIDS; MICROCHANNELS; MICROFLUIDICS; PHASE INTERFACES; POLYDIMETHYLSILOXANE; PULSE WIDTH MODULATION; SILICONES; X RAY PHOTOELECTRON SPECTROSCOPY;

CROSS CONTAMINATION; CRUCIAL PARAMETERS; LAB ON CHIP; LIQUID DISPLACEMENTS; MICRO FLUIDIC SYSTEM; MICRO-FLUIDIC DEVICES; NEGATIVE CAPILLARY PRESSURE; POLYDIMETHYLSILOXANE PDMS;

WETTING;

EID: 84862537878     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2012.04.164     Document Type: Article

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