Effect of Cu addition on Sn-9Zn lead-free solder properties

Hanjie Xuebao/Transactions of the China Welding Institution

Volumn 30, Issue 6, 2009, Pages

  Huang, Huizhen ^a   Liao, Fuping ^a   Wei, Xiuqin ^a   Zhou, Lang ^a  

^a NANCHANG UNIVERSITY   (China)

Author keywords

In situ; Lead free solder; Reinforced composite; Sn Zn alloy; Wettability

Indexed keywords

IN-SITU; LEAD-FREE SOLDER; REINFORCED COMPOSITE; SN-ZN ALLOY; WETTABILITY;

BRAZING; COPPER ALLOYS; COPPER POWDER METALLURGY; LEAD; MECHANICAL PROPERTIES; POWDERS; SOLDERING ALLOYS; TIN ALLOYS; WELDING; ZINC; ZINC ALLOYS;

TIN;

EID: 67650561162     PISSN: 0253360X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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