Effect of super-fine oxide powders on mechanical properties and microstructures of Sn-58Bi

Dalian Ligong Daxue Xuebao/Journal of Dalian University of Technology

Volumn 48, Issue 1, 2008, Pages 51-57

  Liu, Xiao Ying ^a   Ma, Hai Tao ^a   Wang, Lai ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Intermetallic compound; Lead solder joint microstructure; Oxide powders; Sn 58Bi lead free solder

Indexed keywords

ADDITION REACTIONS; ALUMINA; BISMUTH ALLOYS; INTERMETALLICS; IRON OXIDES; MECHANICAL PROPERTIES; MICROSTRUCTURE; POWDERS; SHEAR STRENGTH; SILICA; SOLDERED JOINTS; TIN ALLOYS; TITANIUM OXIDES; WETTING;

INTERMETALLIC COMPOUND; LEAD FREE SOLDER SN 58BI; OXIDE POWDERS; THICKNESS;

SOLDERING ALLOYS;

EID: 43249108918     PISSN: 10008608     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (10)

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