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Journal of Materials Chemistry

Volumn 22, Issue 25, 2012, Pages 12517-12522

Adhesion enhancement of ink-jet printed conductive copper patterns on a flexible substrate

(2) Lee, Young In a Choa, Yong Ho a

a Hanyang University (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION ENHANCEMENT; ADHESION PROMOTER; ADHESION PROMOTION; ADHESIVE STRENGTH; CONDUCTIVE COPPER; COPPER COMPLEXES; COPPER FILMS; COPPER PATTERN; ELECTRICAL CONDUCTIVITY; FIELD EMISSION SCANNING ELECTRON MICROSCOPY; FLEXIBLE SUBSTRATE; FOUR-POINT PROBE TECHNIQUES; INK PROPERTIES; INK-JET; LOW RESISTIVITY; PEEL STRENGTH; PEEL TESTS; POLYIMIDE FILM; SILANE COUPLING AGENT; SUBSTRATE ADHESION; TAPE TESTS;

COPPER; COUPLING AGENTS; ELECTRIC CONDUCTIVITY; FIELD EMISSION MICROSCOPES; IONS; POLYIMIDES; POLYMERIC FILMS; SURFACE TENSION; X RAY DIFFRACTION;

ADHESION;

EID: 84862167782 PISSN: 09599428 EISSN: 13645501 Source Type: Journal
DOI: 10.1039/c2jm31381b Document Type: Article

Times cited : (73)

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