Nanosized glass frit as an adhesion promoter for ink-jet printed conductive patterns on glass substrates annealed at high temperatures

Advanced Functional Materials

Volumn 18, Issue 19, 2008, Pages 2862-2868

  Jang, Daehwan ^a   Kim, Dongjo ^a   Lee, Byoungyoon ^b   Kim, Sungsoo ^b   Kang, Minsoo ^c   Min, Dongki ^c   Moon, Jooho ^a  

^a Yonsei University   (South Korea)

^b Chang Sung Corporation   (South Korea)

^c Daion Co Ltd   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CONDUCTIVE FILMS; CONDUCTIVE MATERIALS; GLASS; INK; METALLIC FILMS;

ADHESION PROMOTERS; CERAMIC SUBSTRATES; CONDUCTIVE INKS; CONDUCTIVE PATTERNS; DISPERSION BEHAVIORS; FILM CONDUCTIVITIES; GLASS FRITS; GLASS SUBSTRATES; HIGH TEMPERATURES; METAL FILMS; METAL NANO PARTICLES; NANOSIZED; PARTICLE CHARACTERISTICS; SUBSTRATE ADHESIONS;

SUBSTRATES;

EID: 55349140425     PISSN: 1616301X     EISSN: 16163028     Source Type: Journal    
DOI: 10.1002/adfm.200800238     Document Type: Article

References (25)

1. T. Muck, J. Fritz, V. Wagner, Appl. Phys. Lett. 2005, 86, 232101.
2. T. Muck, V. Wagner, U. Bass, M. Leufgen, J. Geurts, L. W. Molenkamp, Synth. Met. 2004, 146, 317.
3. E. Tekin, P. J. Smith, U. S. Schubert, Soft Matter. 2008, 4, 703.
4. A. Kamyshny, M. Ben-Moshe, S. Aviezer, S. Magdassi, Macromol. Rapid Commun. 2005, 26, 281.
5. B.-J. Gans, P. C. Duineveld, U. S. Schubert, Adv. Mater. 2004, 16, 203.
6. D. Kim, J. Moon, Electrochem. Solid-State Lett. 2005, 8, J30.
7. D. Kim, S. Jeong, B. Park, J. Moon, Appl. Phys. Lett. 2006, 89, 264101.
8. B. Park, D. Kim, S. Jeong, J. Moon, Thin Solid Films 2007, 515, 7706.
9. P. Calvert, Chem. Mater. 2001, 13, 3299.
10. G. H. Gelinck, T. C. T. Genus, D. M. de Leeuw, Appl. Phys. Lett. 2000, 77, 1487.
11. C. J. Drury, C. M. J. Mutsaers, C. M. Hart, M. Mater, D. M. de Leeuw, Appl. Phys. Lett. 1998, 73, 108.
12. H. Sirringhaus, T. Kawasem, R. H. Friend, T. Shimoda, M. Inbasekaran, W. Wu, E. P. Woo, Science 2000, 290, 2123.
13. P. Liu, Y. Wu, Y. Li, B. S. Ong, S. Zhu, J. Am. Chem. Soc. 2006, 128, 4554.
14. D. Redinger, S. Molesa, S. Yin, R. Farschi, V. Subramanian, IEEE Trans. Electron. Devices 2004, 51, 1978.
15. J. Chung, S. Ko, N. R. Bieri, C. P. Grigoropoulos, D. Poulikakos, Appl. Phys. Lett. 2004, 84, 801.
16. H. H. Lee, K. S. Chou, K. C. Huang, Nanotechnology 2005, 16, 2436.
17. J. Perelaer, B.-J. de Gans, U. S. Schubert, Adv. Mater. 2006, 18, 2101.
18. S. H. Bell, V. T. Crowl, Dispersion of Powders in Liquid, Applied Science Publishers, London 1973, p. 267.
19. D. J. Shaw, Introduction to Colloid and Surface Chemistry, 4th Edn., Butterworth-Heinemann, Oxford 1996, pp. 22, 169, 200, 244.
20. Y. Otsubo, M. Horigome, Korea-Aust. Rheol. J. 2003, 15, 27.
21. M. Pradhan, P. Bhargava, J. Am. Ceram. Soc. 2005, 88, 833.
22. H. G. Yang, C.-Z. Li, H.-C. Gu, T.-N. Fang, J. Colloid Interface Sci. 2001, 236, 96.
23. L. Gaoa, P. Ha rterb, Ch. Linsmeierc, J. Gstottnera, R. Emlinga, D. Schmitt-Landsiedela, Mater. Sci. Semicond. Process 2004, 7, 331.
24. Standard ASTM D3359-02, Standard Test Methods for Measuring Adhesion by Tape Test, West Conshocken, PA, USA 2002.
25. A. Cavallaro, F. Sandiumenge, J. Gàzquez, T. Puig, X. Obradors, J. Arbiol, H. C. Freyhardt, Adv. Funct. Mater. 2006, 16, 1363.