SCOPUS 정보 검색 플랫폼

European Solid-State Device Research Conference

Volumn , Issue , 2011, Pages 279-282

Compensation of externally applied mechanical stress by stacking of ultra-thin chips

(4) Endler, Stefan a Rempp, Horst a Harendt, Christine a Burghartz, Joachim N a

a Institut fur Mikroelektronik Stuttgart (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVE AREA; ACTIVE LAYER; ANALYTICAL MODEL; APPLIED MECHANICAL STRESS; CHIP THICKNESS; CMOS DEVICES; FLEXIBLE SYSTEM; GLUE LAYERS; MECHANICAL BENDING; NEUTRAL LINE; OPTIMUM THICKNESS; SILICON CHIP; STRESS COMPENSATION; THIN CHIPS; ULTRA-THIN CHIPS; VISCOELASTIC BEHAVIORS;

CMOS INTEGRATED CIRCUITS; GLUES; GLUING; MATHEMATICAL MODELS; SOLID STATE DEVICES;

STRESSES;

EID: 82955195094 PISSN: 19308876 EISSN: None Source Type: Conference Proceeding
DOI: 10.1109/ESSDERC.2011.6044180 Document Type: Conference Paper

Times cited : (7)

References (6)

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- International Electron Devices Meeting Tech. Digest, Dec. 2009
- Hassan, M.-U.¹ Rempp, H.² Hoang, T.³ Richter, H.⁴ Wacker, N.⁵ Burghartz, J.N.⁶

2
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- Stiffness and Strength of Multilayer Beams
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- Bareisis, J.¹

3
- 79951823772
- Ultra-Thin Chip Technology for System-in-Foil Applications
- E. A. Angelopoulos, M. Zimmermann, W. Appel, S. Endler, S. Ferwana, C. Harendt, T. Hoang, A. Pruemm, J. N. Burghartz, "Ultra-Thin Chip Technology for System-in-Foil Applications," in International Electron Devices Meeting Tech. Digest, Dec. 2010, pp. 2.5.1-2.5.4.
- International Electron Devices Meeting Tech. Digest, Dec. 2010
- Angelopoulos, E.A.¹ Zimmermann, M.² Appel, W.³ Endler, S.⁴ Ferwana, S.⁵ Harendt, C.⁶ Hoang, T.⁷ Pruemm, A.⁸ Burghartz, J.N.⁹

4
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- CMOS Stress Sensors on (100) Silicon
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- R. C. Jaeger, J. C. Suhling, R. Ramani, A. T. Bradley, J. Xu, "CMOS Stress Sensors on (100) Silicon," IEEE Journal of Solid-State Circuits, Vol. 35, No. 1, pp. 85-95, Jan., 2000.
- (2000) IEEE Journal of Solid-State Circuits , vol.35 , Issue.1 , pp. 85-95
- Jaeger, R.C.¹ Suhling, J.C.² Ramani, R.³ Bradley, A.T.⁴ Xu, J.⁵

5
- 77950315899
- Technology and Design Aspects of Ultra-Thin Silicon Chips for Bendable Electronics
- H. Richter, H. Rempp, M.-U. Hassan, C. Harendt, N. Wacker, M. Zimmermann, J. N. Burghartz, "Technology and Design Aspects of Ultra-Thin Silicon Chips for Bendable Electronics," in Proceedings of the International Conference on IC Design and Technology, May 2009, pp. 149-154.
- Proceedings of the International Conference on IC Design and Technology, May 2009 , pp. 149-154
- Richter, H.¹ Rempp, H.² Hassan, M.-U.³ Harendt, C.⁴ Wacker, N.⁵ Zimmermann, M.⁶ Burghartz, J.N.⁷

6
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- Springer-Verlag
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.