Metal/dielectric liner formation by a simple solution process for through silicon via interconnection

Electrochemical and Solid-State Letters

Volumn 15, Issue 5, 2012, Pages

  Ham, Yong Hyun ^a,b   Kim, Dong Pyo ^a   Baek, Kyu Ha ^a   Park, Kun Sik ^a   Kim, Moonkeun ^b   Kwon, Kwang Ho ^b   Lee, Kijun ^c   Do, Lee Mi ^a  

^a Electronics and Telecommunications Research Institute (ETRI)   (South Korea)

^b Korea University   (South Korea)

^c Chungnam National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CONFORMAL DEPOSITION; DIELECTRIC LINERS; LINER THICKNESS; SOLUTION PROCESS; THROUGH-SILICON-VIA; VIA HOLE;

ELECTROCHEMISTRY; TECHNOLOGY;

SILVER;

EID: 84860185964     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/2.esl113678     Document Type: Article

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