Prospects of active cooling with integrated super-lattice based thin-film thermoelectric devices for mitigating hotspot challenges in microprocessors

Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC

Volumn , Issue , 2012, Pages 633-638

  Alexandrov, Borislav ^a   Sullivan, Owen ^a   Kumar, Satish ^a   Mukhopadhyay, Saibal ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

active cooling; hot spot; Thermoelectric coolers

Indexed keywords

ACTIVE COOLING; CONTROL PRINCIPLE; HEAT SPREADERS; HOT SPOT; THERMAL COMPACT MODELS; THERMOELECTRIC COOLER; THERMOELECTRIC DEVICES; TRANSIENT COOLING; TRANSIENT TEMPERATURE;

COMPUTER AIDED DESIGN; COOLING; ENERGY DISSIPATION; INTEGRATION; MICROPROCESSOR CHIPS; THERMOELECTRIC EQUIPMENT; THERMOELECTRIC REFRIGERATION;

THERMOELECTRICITY;

EID: 84860005525     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ASPDAC.2012.6165033     Document Type: Conference Paper

References (13)

1. I. Chowdhury, R. Prasher, K. Lofgreen, G. Chrysler, S. Narasimhan, R. Mahajan, D. Koester, R. Alley, and R. Vankatasubramanian, "On-chip cooling by superlattice-based thin-film thermoelectrics," Nature Nanotechnology, vol. 4, pp. 235-238, 2009.
2. A. Watwe, and R. Viswanath, "Thermal Implications of Non-uniform Die Power Map and CPU Performance," presented at the Proceedings of InterPACK'03, Maui, HI, July 6-11, 2003.
3. R. Mahajan, Chiu, C.P., and Chrysler, G., "Cooling a Microprocessor Chip," Proceedings of IEEE, vol. 94, pp. 1476-1486, 2006.
4. R. Venkatasubramanian, Siivola, E., Colpitts, T., and O'Quinn, B., "Thin-Film Thermoelectric Devices WIth High Room-Temperature Figures of Merit," Nature, vol. 413, pp. 597-602, 2001.
5. O. Sullivan, Gupta, M.P., Mukhopadhyay, S., and Kumar, S., "Thermoelectric Coolers for Thermal Gradient Management on Chip,"presented at the IMECE, Vancouver, British Columbia, Canada, November 12-18, 2010.
6. Pedro Chaparro, Jose Gonzalez, Qiong Cai, and Greg Chrysler. 2009. "Dynamic thermal management using thin-film thermoelectric cooling," In Proceedings of the 14th ACM/IEEE international symposium on Low power electronics and design (ISLPED '09). ACM, New York, NY, USA, 111-116.
7. Jieyi Long; Memik, S.O.;, "A framework for optimizing thermoelectric active cooling systems," Design Automation Conference (DAC), 2010 47th ACM/IEEE, vol., no., pp.591-596, 13-18 June 2010
8. Jieyi Long; Memik, S.O.; Grayson, M.;, "Optimization of an on-chip active cooling system based on thin-film thermoelectric coolers," Design, Automation & Test in Europe Conference &Exhibition (DATE), 2010, vol., no., pp.117-122, 8-12 March 2010
9. Y.K. Chang, C.H. Tsai, C.C. Teng, S. Kang, Electrothermal Analysis of VLSI Systems; KAP, 2000
10. F. P. Incropera, David P. Dewitt, Theodore L. Bergman, and Adrienne S. Lavine, Fundamentals of Heat and Mass Transfer, Sixth ed.: Wiley, 2006.
11. Kyoungho Woo, et al, "Dual-DLL-based CMOS all-digital temperature sensor for microprocessor thermal monitoring," Solid-State Circuits Conference - Digest of Technical Papers, 2009. ISSCC 2009. IEEE International, vol., no., pp.68-69,69a, 8-12 Feb. 2009
12. Lakdawala, H.; Li, Y.W.; Raychowdhury, A.; Taylor, G.; Soumyanath, K.;, "A 1.05 V 1.6 mW, 0.45°C 3σ Resolution ΣΔ Based Temperature Sensor With Parasitic Resistance Compensation in 32 nm Digital CMOS Process," Solid-State Circuits, IEEE Journal of, vol.44, no.12, pp.3621-3630, Dec. 2009
13. http://www.intel.com/technology/turboboost/index.htm