A framework for optimizing thermoelectric active cooling systems

Proceedings - Design Automation Conference

Volumn , Issue , 2010, Pages 591-596

  Long, Jieyi ^a   Memik, Seda Ogrenci ^a  

^a NORTHWESTERN UNIVERSITY   (United States)

Author keywords

Optimization; Thermal runaway; Thermoelectric cooling

Indexed keywords

ACTIVE COOLING; ACTIVE DEVICES; AVERAGE TEMPERATURE; CHIP PACKAGES; COOLING DEVICES; COOLING SYSTEM DESIGN; CURRENT LEVELS; HEAT DISSIPATION; HOT SPOT; HOTSPOT TEMPERATURE; OPTIMAL CONFIGURATIONS; OPTIMIZATION FRAMEWORK; SILICON DIE; SUPPLY CURRENTS; SUPPLY LEVELS; THERMAL RUNAWAYS; THERMOELECTRIC COOLER; THERMOELECTRIC COOLING; TOTAL POWER CONSUMPTION;

COMPUTER AIDED DESIGN; COOLING; OPTIMIZATION; PACKAGING; REFRIGERATORS; THERMOELECTRIC EQUIPMENT; THERMOELECTRIC REFRIGERATION; THERMOELECTRICITY;

COOLING SYSTEMS;

EID: 77956192485     PISSN: 0738100X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1145/1837274.1837419     Document Type: Conference Paper

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