Thermoelectric coolers for thermal gradient management on chip

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)

Volumn 4, Issue , 2010, Pages 187-195

  Sullivan, Owen ^a   Mukhopadhyay, Saibal ^a   Gupta, Man Prakash ^a   Kumar, Satish ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING SYSTEMS; ENERGY EFFICIENCY; THERMAL MANAGEMENT (ELECTRONICS); THERMOELECTRIC EQUIPMENT; THERMOELECTRIC REFRIGERATION;

COOLING SOLUTIONS; CURRENT PULSE; HOTSPOTS; ON CHIPS; ON DEMANDS; PEAK TEMPERATURES; PULSE PROFILE; SITE-SPECIFIC; THERMAL PROFILES; THERMOELECTRIC COOLER;

ELECTRONIC COOLING;

EID: 84881461610     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2010-38184     Document Type: Conference Paper

References (19)

1. Watwe, A., and Viswanath, R. (2003), Thermal Implications of Non-uniform Die Power Map and CPU Performance, Presented at Proceedings of InterPACK?03, Maui, HI, July 6-11.
2. Chowdhury, I., Prasher, R., Lofgreen, K., Chrysler, G., Narasimhan, S., Mahajan, R., Koester, D., Alley, R., and Venkatasubramanian, R., (2009) 'On-chip cooling by superlattice-based thin-film thermoelectrics', Nat. Nanotechnol., vol. 4, pp. 235-238.
3. Mahajan, R., Chiu, C.P., and Chrysler, G., (2006) 'Cooling a microprocessor chip', Proc. IEEE, vol. 94, pp. 1476-1486.
4. Venkatasubramanian, R., Siivola, E., Colpitts, T., and O.Quinn, B., (2001) 'Thin-Film Thermoelectric Devices With High Room-Temperature Figures of Merit,' Nature, vol. 413, pp. 597-602.
5. Harman, T. C., Taylor, P. J., Walsh, M. P., and LaForge, B. E., (2002) 'Quantum Dot Superlattice Thermoelectric Materials and Devices,' Science, vol. 297, pp. 2229-223.
6. Shakouri, A., and Zhang, Y., (2005) 'On-Chip Solid-State Cooling for Integrated Circuits Using Thin-Film Microrefrigerators,' IEEE Transactions on Components and Packaging Technologies, vol. 28, pp. 65-69.
7. Tritt, T.M. and Subramanian, M.A., (2006) 'Thermoelectric materials, phenomena, and applications: A bird's eye view', MRS Bull., vol. 31, pp. 188-194.
8. Bulman, G. E., Siivola, E., Shen, B., and Venkatasubramanian, R., (2006) "Large External Delta T and Cooling Power Densities in Thin-Film Bi2Te3-Superlattice Thermoelectric Cooling Devices, ? Applied Physics Letters, vol. 89, 122117.
9. Hone, J., Ellwood, I., Muno, M., Mizel, A., Cohen, M.L., Zettl, A., Rinzler, A.G., and Smalley, R.E., (1998) 'Thermoelectric power of single-walled carbon nanotubes', Physical Review Letters, vol. 80, pp. 1042-1045.
10. Hsu, K.F., Loo, S., Guo, F., Chen, W., Dyck, J.S., Uher, C., Hogan, T., Polychroniadis, E.K., and Kanatzidis, M.G., (2004) 'Cubic AgPbmSbTe2+m: Bulk thermoelectric materials with high figure of merit', Science, vol. 303, pp. 818-821.
11. Poudel, B., Hao, Q., Ma, Y., Lan, Y.C., Minnich, A., Yu, B., Yan, X., Wang, D.Z., Muto, A., Vashaee, D., Chen, X.Y., Liu, J.M., Dresselhaus, M.S., Chen, G., and Ren, Z., (2008) 'High-thermoelectric performance of nanostructured bismuth antimony telluride bulk alloys', Science, vol. 320, pp. 634- 638.
12. Litivinovitch, V. and Cohen, A.B., "Effect of thermal contact resistance on optimum mini-contact TEC cooling on on-chip hot spots " presented at InterPACK, San Francisco, USA, 2009.
13. Ju Y. S., (2008) "Impact of Interface Resistance on Pulsed Thermoelectric cooling, ? J. Heat Transfer 130, 014502.
14. Riffat, S.B., Ma, X.L., (2003) "Thermoelectrics: A review of present and potential applications, ? Applied Thermal Engg., 23 (8): 913-935.
15. Snyder, G.J., Fleurial, J.P., Caillat, T., Yang, R.G., and Chen, G., (2002) 'Supercooling of Peltier cooler using a current pulse', J. Appl. Phys., vol. 92, pp. 1564-1569.
16. Yang, R.G., Chen, G., Kumar, A.R., Snyder, G.J., Fleurial, J.P., (2005) "Transient cooling of thermoelectric coolers and its applications for microdevices, ? Energy Conversion and Management, vol. 46, Issues 9-10, pp. 1407- 1420.
17. Zhou, Q., Bian, Z., and Shakouri, A., (2007) 'Pulsed cooling of inhomogeneous thermoelectric materials', J. Phys. D-Appl. Phys., vol. 40, pp. 4376-4381.
18. Gupta, M., Sayer, M., Mukhopadhyay, S., Kumar, S., "On-chip Peltier cooling using current pulse", presented at ITherm 2010, Las Vegas, Nevada.
19. Thonhauser, T., Mahan, G.D., Zikatanov, L., Roe, J., (2004) "Improved supercooling in transient thermoelectrics, ' Applied Physics Letters, vol. 85, pp. 3247-3249.