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Volumn , Issue , 2010, Pages 117-122

Optimization of an on-chip active cooling system based on thin-film thermoelectric coolers

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVE COOLING; CHIP PACKAGES; COMPACT THERMAL MODELS; CONVEX PROGRAMMING; DESIGN AND OPTIMIZATION; GREEDY ALGORITHMS; HOT SPOT; ON CHIPS; OPTIMALITY CONDITIONS; POSITIVE MATRICES; SUPPLY CURRENTS; SYSTEM LEVEL DESIGN; SYSTEM-BASED; THERMAL RUNAWAYS; THERMOELECTRIC COOLER;

EID: 77953102967     PISSN: 15301591     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (20)

References (21)
  • 1
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    • Chowdhury, I.1
  • 4
    • 55349142096 scopus 로고    scopus 로고
    • Development of Low-Cost Micro-Thermoelectric Coolers Utilizing MEMS Technology
    • Huang, I., et al., Development of Low-Cost Micro-Thermoelectric Coolers Utilizing MEMS Technology. Sensors and Actuators A: Physical, 2008. 148: p. 176-185.
    • (2008) Sensors and Actuators A: Physical , vol.148 , pp. 176-185
    • Huang, I.1
  • 5
    • 0036767710 scopus 로고    scopus 로고
    • Current and Future Miniature Refrigeration Cooling Technologies for High Power Microelectronics
    • Phelan, P.E., et al., Current and Future Miniature Refrigeration Cooling Technologies for High Power Microelectronics. IEEE Transactions on Components and Packaging Technologies, 2002. 25(3): p. 356-365.
    • (2002) IEEE Transactions on Components and Packaging Technologies , vol.25 , Issue.3 , pp. 356-365
    • Phelan, P.E.1
  • 6
    • 62149090558 scopus 로고    scopus 로고
    • Mini-Contact Enhanced Thermoelectric Coolers for On- Chip Hot Spot Cooling
    • Wang, P., et al., Mini-Contact Enhanced Thermoelectric Coolers for On- Chip Hot Spot Cooling. Heat Transfer Engineering, 2009. 30(9): p. 736-743.
    • (2009) Heat Transfer Engineering , vol.30 , Issue.9 , pp. 736-743
    • Wang, P.1
  • 11
    • 0003943048 scopus 로고    scopus 로고
    • Springer Series in Computational Mathematics. Springer
    • Varga, R.S., Matrix Iterative Analysis. Springer Series in Computational Mathematics. 2000: Springer.
    • (2000) Matrix Iterative Analysis
    • Varga, R.S.1
  • 12
    • 38749107579 scopus 로고    scopus 로고
    • Numerical Optimization of the Thermoelectric Cooling Devices
    • Abramzon, B., Numerical Optimization of the Thermoelectric Cooling Devices. ASME Journal of Electronic Packaging, 2007. 129(3): p. 339-347.
    • (2007) ASME Journal of Electronic Packaging , vol.129 , Issue.3 , pp. 339-347
    • Abramzon, B.1
  • 13
    • 67650479725 scopus 로고    scopus 로고
    • Optimization of Microscale Thermoelectric Cooling (TEC) Element Dimensions for Hotspot Cooling Applications
    • Hou, P.Y., et al., Optimization of Microscale Thermoelectric Cooling (TEC) Element Dimensions for Hotspot Cooling Applications. Journal of Electronic Materials, 2009. 38(7): p. 950-953.
    • (2009) Journal of Electronic Materials , vol.38 , Issue.7 , pp. 950-953
    • Hou, P.Y.1
  • 18
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    • Cambridge University Press
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    • (2004) Convex Optimization
    • Boyd, S.1
  • 20
    • 33846535493 scopus 로고    scopus 로고
    • The M5 Simulator: Modeling Networked Systems
    • Binkert, N.L.D., et al., The M5 Simulator: Modeling Networked Systems. Micro, IEEE, 2006. 26(4): p. 52-60.
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    • Binkert, N.L.D.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.