메뉴 건너뛰기




Volumn 2, Issue 4, 2012, Pages 578-586

Thermal performance assessment and validation of high-concentration photovoltaic solar cell module

Author keywords

Finite element; high concentration photovoltaic system; solar cell; thermal management

Indexed keywords

BASELINE MODELS; DESIGN PARAMETERS; DEVICE TEMPERATURE; ELECTRICAL ENERGY; FE MODEL; FINITE ELEMENT; FINITE ELEMENTS; HIGH-CONCENTRATION PHOTOVOLTAIC; OPERATION CONDITIONS; OUTDOOR EXPERIMENT; PACKAGE DESIGNS; PHOTOVOLTAIC SYSTEMS; SYSTEM OUTPUT; THERMAL PERFORMANCE;

EID: 84859758916     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2011.2181165     Document Type: Article
Times cited : (46)

References (14)
  • 1
    • 0031246907 scopus 로고    scopus 로고
    • Integrated highconcentration PV. Near-term alternative for low-cost large-scale solar electric power
    • Oct.
    • V. Garboushian, D. Roubideaux, and S. Yoon, "Integrated highconcentration PV. Near-term alternative for low-cost large-scale solar electric power," Solar Energy Mater. Solar Cells, vol. 47, pp. 315-323, Oct. 1997.
    • (1997) Solar Energy Mater. Solar Cells , vol.47 , pp. 315-323
    • Garboushian, V.1    Roubideaux, D.2    Yoon, S.3
  • 2
    • 0033357731 scopus 로고    scopus 로고
    • High efficiency and high concentration in photovoltaics
    • Oct.
    • M. Yamaguchi and A. Luque, "High efficiency and high concentration in photovoltaics," IEEE Trans. Electron Dev., vol. 46, no. 10, pp. 2139-2144, Oct. 1999.
    • (1999) IEEE Trans. Electron Dev. , vol.46 , Issue.10 , pp. 2139-2144
    • Yamaguchi, M.1    Luque, A.2
  • 4
    • 0028704122 scopus 로고
    • Reduced temperature dependence of high-concentration photovoltaic solar cell open-circuit voltage (Voc) at high concentration levels
    • Waikoloa, HI Dec.
    • S. Yoon, V. Garboushian, and D. Roubideaux, "Reduced temperature dependence of high-concentration photovoltaic solar cell open-circuit voltage (Voc) at high concentration levels," in Proc. IEEE Photovoltaic Spec. Conf., Waikoloa, HI, Dec. 1994, pp. 1500-1504.
    • (1994) Proc. IEEE Photovoltaic Spec. Conf. , pp. 1500-1504
    • Yoon, S.1    Garboushian, V.2    Roubideaux, D.3
  • 5
    • 41749098818 scopus 로고    scopus 로고
    • Temperature dependence of the IV parameters from triple junction GaInP/InGaAs/Ge concentrator solar cells
    • Waikoloa, HI May
    • H. Cotal and R. Sherif, "Temperature dependence of the IV parameters from triple junction GaInP/InGaAs/Ge concentrator solar cells," in Proc. IEEE 4th World Conf. Photovoltaic Energy Conv., Waikoloa, HI, May 2006, pp. 845-848.
    • (2006) Proc. IEEE 4th World Conf. Photovoltaic Energy Conv. , pp. 845-848
    • Cotal, H.1    Sherif, R.2
  • 7
    • 0035389454 scopus 로고    scopus 로고
    • Thermal/mechanical analysis of novel CTSOP using nonlinear FEM method
    • J. C. Lin and K. N. Chiang, "Thermal/mechanical analysis of novel CTSOP using nonlinear FEM method," J. Chin. Inst. Eng., vol. 24, no. 4, pp. 453-462, 2001.
    • (2001) J. Chin. Inst. Eng. , vol.24 , Issue.4 , pp. 453-462
    • Lin, J.C.1    Chiang, K.N.2
  • 8
    • 0038142334 scopus 로고    scopus 로고
    • An effective methodology for thermal characterization of electronic packaging
    • Mar.
    • W. H. Chen, H. C. Cheng, and H. A. Shen, "An effective methodology for thermal characterization of electronic packaging," IEEE Trans. Compon. Packag. Technol., vol. 26, no. 1, pp. 222-232, Mar. 2003.
    • (2003) IEEE Trans. Compon. Packag. Technol. , vol.26 , Issue.1 , pp. 222-232
    • Chen, W.H.1    Cheng, H.C.2    Shen, H.A.3
  • 9
    • 30844455359 scopus 로고    scopus 로고
    • Thermal resistance analysis and validation of flip chip PBGA packages
    • Feb.-Apr.
    • K. M. Chen, K. H. Houng, and K. N. Chiang, "Thermal resistance analysis and validation of flip chip PBGA packages," Microelectron. Reliab., vol. 46, pp. 440-448, Feb.-Apr. 2006.
    • (2006) Microelectron. Reliab. , vol.46 , pp. 440-448
    • Chen, K.M.1    Houng, K.H.2    Chiang, K.N.3
  • 10
    • 40449094979 scopus 로고    scopus 로고
    • Thermal management on hot spot elimination/junction temperature reduction for high power density system in package structure
    • Jul.
    • C. Y. Chou, C. J. Wu, H. P. Wei, M. C. Yew, C. C. Chiu, and K. N. Chiang, "Thermal management on hot spot elimination/junction temperature reduction for high power density system in package structure," in Proc. Int. Electron. Packag. Tech. Conf. Exhibit., Jul. 2007, pp. 227-232.
    • (2007) Proc. Int. Electron. Packag. Tech. Conf. Exhibit. , pp. 227-232
    • Chou, C.Y.1    Wu, C.J.2    Wei, H.P.3    Yew, M.C.4    Chiu, C.C.5    Chiang, K.N.6
  • 13
    • 0030167874 scopus 로고    scopus 로고
    • Thermal simulation to analyze design feature of plastic quad flat packages
    • G. Ridsdale, B. Joiner, J. Bigler, and V. M. Torres, "Thermal simulation to analyze design feature of plastic quad flat packages," Int. J. Microcircuits Electron. Packag., vol. 19, no. 2, pp. 103-109, 1996.
    • (1996) Int. J. Microcircuits Electron. Packag. , vol.19 , Issue.2 , pp. 103-109
    • Ridsdale, G.1    Joiner, B.2    Bigler, V.M.3    Torres, J.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.