Thermal simulation to analyze design features of plastic quad flat packages

International Journal of Microcircuits and Electronic Packaging

Volumn 19, Issue 2, 1996, Pages 103-109

  Ridsdale, Greg ^a   Joiner, Bennett ^a   Bigler, Jerry ^a   Torres, Victor M ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMATION; COMPUTER AIDED DESIGN; COMPUTER PROGRAMMING LANGUAGES; COMPUTER SIMULATION; FINITE ELEMENT METHOD; PERFORMANCE; PRINTED CIRCUIT BOARDS; THERMAL VARIABLES MEASUREMENT; THERMOANALYSIS; THERMODYNAMIC PROPERTIES;

ANSYS PARAMETRIC DESIGN LANGUAGE; AUTOMATIC MODEL GENERATOR; LEADFRAME PACKAGES; PLASTIC QUAD FLAT PACKAGES; THERMAL RESISTANCE; THERMAL SIMULATION;

ELECTRONICS PACKAGING;

EID: 0030167874     PISSN: 10631674     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (7)