Thermal/mechanical analysis of novel Ceramic-TSOP using nonlinear finite element method

Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an

Volumn 24, Issue 4, 2001, Pages 453-462

  Lin, Ji Cheng ^a   Chiang, Kuo Ning ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Finite element method; Leadframe; Solder joint reliability; Thermal performance; TSOP

Indexed keywords

ADHESIVES; CERAMIC MATERIALS; FINITE ELEMENT METHOD; HEAT CONVECTION; HEAT LOSSES; MOLDING; SOLDERED JOINTS; THERMAL CONDUCTIVITY; THERMAL LOAD; THERMAL STRESS; THERMOANALYSIS;

CERAMIC PACKAGES;

CHIP SCALE PACKAGES;

EID: 0035389454     PISSN: 02533839     EISSN: 21587299     Source Type: Journal    
DOI: 10.1080/02533839.2001.9670642     Document Type: Article

References (16)

1. Mertol, A., 1992. “Stress Analysis and Thermal Characterization of a High Pin Count PQFP”. Journal of Electronic Packaging, 114:211–220.
2. Cho, S. J., Park, S. W., Park, M. G., and Kim, D.H., 2000. “A Novel Robust and Low Cost Stack Chip Package and Its thermal Performance”. IEEE Transactions on Advanced Packaging, 23 (2):257–265.
3. Ellison, G. N., 1989. Thermal Computations for Electronic Equipment, New York:Van Nostrand Reinhole Company.
4. Solomon, H. D., 1986. “Fatigue of 60/40 Solder”. IEEE Transactions on Components, Hybrids and Manufacturing Technology, CHMT-9:91–104.
5. Lau, J. H., 1991. Solder Joint Reliability:Theory and Application, New York:Van Nostrand Reinhold.
6. Lau, J. H., and Pao, Y.-H., 1997. Solder Joint Reliability of BGA, CSP, Flip Chip and Fine Pitch SMT Assemblies, New York:McGraw-Hill.
7. Lau, J. H., and Erasmus, S., 1993. “Reliability of Fine Pitch Plastic Quad Flat Pack Leads and Solder Joints Under Bending, Twisting, and Thermal Conditions”. Journal of Electronic Packaging, 115 September:322–328.
8. JESD 51, Methodology for the thermal Measurement of Component Packages
9. Ko, M., Shin, D., Moon, M., Lee, I., Park, Y., Jung, Y., and Song, C., “The Effect of Mold Compounds on Warpage in LOC Package”. Electronic Components and Technology Conference. pp. 1196–1200.
10. Lai, H. Y., Chen, C. K., and Yeh, Y. L., “Effect of IC Layouts and Packaging Materials on the Efficiency of Heat Dissipation”. Proceedings ChipMos Technical Symposium. pp. 129–137.
11. Lau, J., Golwalkar, S., Erasmus, S., Surratt, R., and Boysan, P., 1992. “Experimental and Analytical Studies of 28-pin Thin Small Outline Package (TSOP) Solder-Joint Reliability”. Journal of Electronic Packaging, 114 June:169–176.
12. Aghazadeh, M., and Mallik, D., 1990. “Thermal Characteristics of Single and Multilayer High Performance PQFP Packages”. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 13 (4):975–979.
13. Yu, Q., and Shiratori, M., 1997. “Fatigue-Strength Prediction of Mircoelectronics Solder Joints Under Thermal Cyclic Loading”. IEEE Transactions on Components, Packaging, and Manufacturing technology-part A, 20 (3):266–273.
14. Liu, S., Zhu, J. S., Hu, J. M., and Pao, Y. H., 1995. “Ceramic/conductive epoxy/glass systems”. IEEE Transactions on Components, Packaging, and Manufacturing technology-part A, 18 (3) September:627–633.
15. Yi, S., and Sze, K. Y., 1998. “Finite Element Analysis of Moisture Distribution and Hygrothermal Stress in TSOP IC package”. Finite Element in Analysis and Design, 30:65–79.
16. Mei, Z., “TSOP Solder Joint Reliability”. Electronic Components and Technology Conference. pp. 1232–1238.