Thermal resistance analysis and validation of flip chip PBGA packages

Microelectronics Reliability

Volumn 46, Issue 2-4, 2006, Pages 440-448

  Chen, Kuo Ming ^a   Houng, Kuo Hsiung ^b   Chiang, Kuo Ning ^c  

^a UNITED MICROELECTRONICS CORPORATION   (Taiwan)

^b TwinMos Technology Inc Corporation   (Taiwan)

^c NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; FINITE ELEMENT METHOD; HEAT RESISTANCE; SUBSTRATES; THERMOANALYSIS;

ALUMINUM CAP; BARE DIE; FLIP CHIP PBGA PACKAGES; FLIP CHIP-PLASTIC BALL GRID ARRAY (FC-PBGA);

CHIP SCALE PACKAGES;

EID: 30844455359     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2005.06.001     Document Type: Article

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