Thermal management on hot spot elimination / junction temperature reduction for high power density system in package structure

2007 Proceedings of the ASME InterPack Conference, IPACK 2007

Volumn 1, Issue , 2007, Pages 227-232

  Chou, Chan Yen ^a   Wu, Chung Jung ^a   Wei, Hsiu Ping ^a   Yew, Ming Chih ^a   Chiu, Chien Chia ^a   Chiang, Kuo Ning ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP CARRIERS; HOT SPOT ELIMINATION; JUNCTION TEMPERATURE REDUCTION; POWER DENSITY SYSTEMS;

ELECTRIC POWER SYSTEMS; ENERGY DISSIPATION; PRODUCT DESIGN; SEMICONDUCTOR JUNCTIONS; TEMPERATURE CONTROL;

CHIP SCALE PACKAGES;

EID: 40449094979     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IPACK2007-33534     Document Type: Conference Paper

References (12)