Thermal and electrical performance for wafer level package

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 301-310

  Park, Sang Wook ^a   Kim, Jae Myun ^a   Baik, Hyung Gil ^a   Kim, Sang Ha ^a   Hong, Joon Ki ^a   Chun, Heung Sup ^a  

^a Hynix Semiconductor Inc   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; DYNAMIC RANDOM ACCESS STORAGE; FINITE ELEMENT METHOD; TEMPERATURE; THERMOELECTRICITY;

CHIP SIZE PACKAGE; ELECTRICAL PARASITIC PARAMETER; PERSONAL DIGITAL ASSISTANT;

ELECTRONICS PACKAGING;

EID: 0034482524     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (11)