Packaged substrate solutions for next generation products

Advancing Microelectronics

Volumn 34, Issue 6, 2007, Pages 22-26

  Huemoeller, Ron ^a  

^a AMKOR TECHNOLOGY   (United States)

Author keywords

Ablation; BGA; Embedded; Laser

Indexed keywords

ABLATION; CHIP SCALE PACKAGES; COST REDUCTION; COSTS; DISTRIBUTED COMPUTER SYSTEMS; ELECTRIC GENERATORS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS INDUSTRY; ELECTRONICS PACKAGING; FINANCE; INDUSTRIAL ECONOMICS; INTEGRATED CIRCUITS; LASER ABLATION; LASERS; MINIATURE INSTRUMENTS; OPTICAL DESIGN; PULSED LASER DEPOSITION; SEMICONDUCTOR GROWTH; SEMICONDUCTOR LASERS; SIZE DETERMINATION; TECHNOLOGY; VIBRATIONS (MECHANICAL);

BGA; COLLABORATIVE EFFORTS; DESIGN FEATURES; DISRUPTIVE TECHNOLOGIES; ELECTRICAL PATHS; ELECTRICAL PERFORMANCES; EMBEDDED; FEATURE SIZES; INNOVATIVE TECHNOLOGIES; LASER; LASER ABLATION TECHNIQUES; MANUFACTURING TECHNIQUES; NEW SOLUTIONS; NEXT GENERATION PRODUCTS; PACKAGING INDUSTRIES; PACKAGING TECHNOLOGIES; PLATING PROCESSES; SIGNAL PATHS; SIGNAL PROPAGATION; STATE-OF-THE-ART TECHNOLOGIES; STRUCTURED APPROACH; SUBSTRATE SOLUTIONS;

SUBSTRATES;

EID: 48849087268     PISSN: None     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (7)

1. BPA Consulting (2006), "Worldwide High-Speed Electronics Technology and Market Trends for the Years 2006-2016," Executive Market and Technology Forum, pp. 59, 64-65, Sept. 2006.
2. Huemoeller, R., Rusli, S. (2005). "Integrated Circuit Substrate Having Laser-Embedded Conductive Patterns and Method Therefor," U.S. Pat. 6,930,256, issued Aug. 16, 2005.
3. Baron, et al. (2006). "Unveiling the Next Generation in Substrate Technology," Pan Pacific Technology Symposium, January 2007.
4. Appasamy, et al. (2006). "Unveiling the Next Generation in Integrated Circuit Substrate Circuit Formation," CircuiTree, pp. 12-18, June 2007.
5. Anvik Corporation. "Unveiling the Next Generation in Integrated Circuit Substrate Circuit Formation," CircuiTree, pp. 12-18, June 2007.
6. Jain, K. (2004). Large-Area, High-Throughput, High-Resolution, Projection Imaging System, U.S. Pat. 5,285,236, issued Feb. 8, 1994.
7. Jain, K., et al., (2002). "Large-Area Excimer Laser Lithography and Photoablation Systems," Microlithography World, Vol. 11, No. 3, p. 8, Aug. 2002.