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Acta Materialia

Volumn 60, Issue 5, 2012, Pages 2209-2218

In situ TEM observation of grain annihilation in tricrystalline aluminum films

(6) Mompiou, F a Legros, M a Radetic, T b Dahmen, U b Gianola, D S c Hemker, K J d

a CEMES CNRS (France)

b UNIVERSITY OF CALIFORNIA (United States)

c UNIVERSITY OF PENNSYLVANIA (United States)

d Johns Hopkins University (United States)

Author keywords

Grain boundary; In situ TEM; Shear migration coupling; Surface tension stress; Tricrystal

Indexed keywords

ALUMINUM FILM; APPLIED STRESS; COUPLING FACTOR; GRAIN ANNIHILATION; GRAIN ROTATION; IN-SITU TEM; IN-SITU TRANSMISSION; INTERMEDIATE TEMPERATURES; TRICRYSTAL;

DEFORMATION; IN SITU PROCESSING; SURFACE TENSION; TRANSMISSION ELECTRON MICROSCOPY;

GRAIN BOUNDARIES;

EID: 84858258528 PISSN: 13596454 EISSN: None Source Type: Journal
DOI: 10.1016/j.actamat.2011.12.013 Document Type: Article

Times cited : (41)

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