A review of three-dimensional viscoelastic models with an application to viscoelasticity characterization using nanoindentation

Microelectronics Reliability

Volumn 52, Issue 3, 2012, Pages 541-558

  Chen, Dao Long ^a   Yang, Ping Feng ^a   Lai, Yi Shao ^a  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BOLTZMANN; BURGERS MODEL; CREEP COMPLIANCE; CREEP TESTS; CURVE FITTING METHODS; DYNAMIC LOADING TEST; FITTING RESULTS; KELVIN MODEL; NANOINDENTATION TESTS; PHYSICAL MEANINGS; POISSON'S RATIO; RELAXATION MODULUS; RELAXATION TEST; TIME-DEPENDENT; VISCO-ELASTIC PARAMETERS; VISCOELASTIC BEHAVIORS; VISCOELASTIC FUNCTIONS; VISCOELASTIC MODELS;

CREEP; CURVE FITTING; DYNAMIC LOADS; MODELS; NANOINDENTATION; VISCOELASTICITY;

THREE DIMENSIONAL;

EID: 84857369366     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2011.10.001     Document Type: Review

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