Viscoelastic warpage analysis of surface mount package

Journal of Electronic Packaging

Volumn 123, Issue 2, 2001, Pages 101-104

  Miyake, Kiyoshi ^a   Yoshida, Tsukasa ^a   Baik, Hyung Gil ^b   Park, Sang Wook ^b  

^a NITTO DENKO CORPORATION   (Japan)

^b Hyundai Syscomm Inc   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0042907276     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1339820     Document Type: Article

References (11)

1. Lee, C. K., and Yan, J. C., 1998, "Warpage in Plastic IC Packages," 48th ECTC.
2. Miyake, K., and Saitou, K., 1997, "Analysis of Warpage of Surface Mount Devices, JSME The 10th Computer Mechanics Conf., pp. 41-42.
3. Sang, W. P., Hyung, G. B., Suck, J. Y., Kwang, Y. B., and Kil, S. R., 1998, "Warpage Simulation for TSOP (LOC)-Package," SEMICON Korea.
4. Miyake, K., Yoshida, T., Hyung, G. B., and Sang, W. P., 1999 "Visco-elastic Warpage Analysis of Surface Mount Package," ASME Advances in Electronic Packaging, EEP-Vol. 26-1, pp. 1041-1046.
5. Miyake, K., Yoshida, T., Hyung, G. B., and Sang, W. P., 1999 "Visco-elastic Warpage Analysis of TSOP" 4th ICRMS99 Shanghai, pp. 353-358.
6. Brian, D. H., 1997, "Effects of Temperature and Moisture upon the Mechanical Behavior of an Epoxy Molding Compound," ASME Advances in ElecIronic Packaging, EEP Vol. 19-1.
7. Lance, R. W., Shane, T. S., and Yves, H. B., 1997, "An Experimental-Numerical Technique for Evaluating the Bulk and Shear Dynamic Moduli of Viscoelastic Materials," J. Acoust. Soc. Am., 102, No. 6, pp. 3549-3555.
8. Nakamura, S., Hasebe A., and Serizawa, K., 1995, "Thermo-viscoelastic Analysis of Warp Deformation for Resin and Metal Laminated Substrate," 6th MES95.
9. Sasaki, K., Saitou, N., Amagi, S., and Haraguchi, Y., 1998 "Numerical Analysis of Residual Stress in Resin-Molded Poducts," Trans. Jpn. Soc. Mech. Eng., Ser. A 64, No. 622, pp. 1660-1666.
10. MARC Manual-A, 1998, pp. 272-276.
11. Miki, Y., Onishi, H., and Asano, T., 1986, "Analysis of Contact Process of Adhesive Tape," Nitto Technical Report, 2, No. 24, pp. 16-27.