SCOPUS 정보 검색 플랫폼

Volumn 13, Issue 6-7, 2007, Pages 861-864

Interaction of copper organometallic precursors with barrier layers of Ti, Ta and W and their nitrides: A first-principles molecular dynamics study

(7) Machado, Eduardo a Kaczmarski, Marcin a Braida, Benoît b Ordejón, Pablo a Garg, Diwakar c Norman, John c Cheng, Hansong c

a INSTITUT DE CIÈNCIA DE MATERIALS DE BARCELONA ICMAB CSIC (Spain)

b LABORATOIRE DE CHIMIE THÉORIQUE (France)

c AIR PRODUCTS AND CHEMICALS INC (United States)

Author keywords

Abinitio molecular dynamics; Chemical vapor deposition; Copperfilms; CupraSelect

Indexed keywords

COPPER COMPLEX; NITROGEN; ORGANOMETALLIC COMPOUND; TANTALUM; TITANIUM; TUNGSTEN;

ARTICLE; CHEMICAL BOND; CHEMICAL STRUCTURE; CONTROLLED STUDY; DECOMPOSITION; MOLECULAR DYNAMICS; MOLECULAR INTERACTION; MOLECULAR MODEL; PRIORITY JOURNAL; SURFACE PROPERTY;

COMPUTER SIMULATION; COPPER; HEAT; MODELS, CHEMICAL; MOLECULAR CONFORMATION; SURFACE PROPERTIES; TANTALUM; TITANIUM; TUNGSTEN; VOLATILIZATION;

EID: 34347387748 PISSN: 16102940 EISSN: 09485023 Source Type: Journal
DOI: 10.1007/s00894-007-0187-6 Document Type: Article

Times cited : (11)

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