Fabrication of very fine copper lines on silicon substrates patterned with poly(methylmethacrylate) via selective chemical vapor deposition

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 22, Issue 2, 2004, Pages 859-860

  Davazoglou, D ^a   Raptis, I ^a   Gleizes, A ^b   Vasilopoulou, M ^a  

^a INSTITUTE OF NANOSCIENCE AND NANOTECHNOLOGY   (Greece)

^b CNRS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL VAPOR DEPOSITION; DECOMPOSITION; DIELECTRIC MATERIALS; ELECTRODES; ELECTRON BEAM LITHOGRAPHY; FREE RADICALS; HELIUM; NANOTECHNOLOGY; POLYMETHYL METHACRYLATES; SCANNING ELECTRON MICROSCOPY; SILICON; SUBSTRATES; THERMAL EFFECTS; VAPORS;

COPPER LINES; MOLAR FRACTION; MOLECULAR PRECURSORS; RESIST PATTERNING;

COPPER;

EID: 2342479852     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1651552     Document Type: Article

References (5)

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