Investigation of the effect of solidification processing parameters on the rod spacings and variation of microhardness with the rod spacing in the Sn-Cu hypereutectic alloy

Journal of Materials Science: Materials in Electronics

Volumn 21, Issue 6, 2010, Pages 608-618

  Cadirli E ^a   Boyuk U ^b   Engin, S ^b   Kaya, H ^b   Marasli N ^b   Keslioglu K ^b   Ulgen A ^b  

^a NIGDE UNIVERSITY   (Turkey)

^b ERCIYES UNIVERSITY   (Turkey)

Author keywords

[No Author keywords available]

Indexed keywords

ATMOSPHERIC TEMPERATURE; BINARY ALLOYS; COPPER ALLOYS; EUTECTICS; GROWTH RATE; MICROHARDNESS; SOLIDIFICATION; THERMAL GRADIENTS;

ARGON ATMOSPHERES; CONSTANT GROWTH RATES; CONSTANT TEMPERATURE; DIRECTIONALLY SOLIDIFIED; EUTECTIC STRUCTURES; GRAPHITE CRUCIBLES; HYPEREUTECTIC ALLOY; SOLIDIFICATION PROCESSING;

TIN ALLOYS;

EID: 77955579181     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-009-9965-5     Document Type: Article

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