Performance evaluation of air-gap-based coaxial RF TSV for 3D NoC

2011 IEEE/IFIP 19th International Conference on VLSI and System-on-Chip, VLSI-SoC 2011

Volumn , Issue , 2011, Pages 94-97

  Yu, Le ^a,b   Yang, Haigang ^a   Zhang, Jia ^a,b   Wang, Wei ^c  

^a INSTITUTE OF ELECTRONICS   (China)

^b UNIVERSITY OF CHINESE ACADEMY OF SCIENCES   (China)

^c INSTITUTE OF MICROELECTRONICS   (China)

Author keywords

air gap; Binary Phase Shift Keying (BPSK); coaxial; radio frequency (RF); three dimensional (3D); through silicon via (TSV)

Indexed keywords

AIR-GAPS; BINARY PHASE SHIFT KEYING (BPSK); COAXIAL; RADIO FREQUENCY (RF); THREE DIMENSIONAL (3D); THROUGH-SILICON VIA (TSV);

APPLICATION SPECIFIC INTEGRATED CIRCUITS; BANDWIDTH; BINARY PHASE SHIFT KEYING; ENERGY DISSIPATION; MICROPROCESSOR CHIPS; PHASE SHIFT; PHASE SHIFTERS; THREE DIMENSIONAL; VLSI CIRCUITS;

PROGRAMMABLE LOGIC CONTROLLERS;

EID: 83755219397     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/VLSISoC.2011.6081658     Document Type: Conference Paper

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