Benchmarking different substrates for thick-film sensors of mechanical quantities

15th European Microelectronics and Packaging Conference and Exhibition, EMPC 2005 - Conference Programme and Proceedings

Volumn , Issue , 2005, Pages 216-221

  Belavič, Darko ^a   Hrovat, Marko ^b   Zarnik, Marina Santo ^a   Cilenšek, Jena ^b   Kita, Jaroslaw ^c   Golonka, Leszek ^c   Dziedzic, Andrzej ^c   Smetana, Walter ^d   Homolka, Heinz ^d   Reicher, Roland ^d  

^a HIPOT RandD   (Slovenia)

^b JO EF STEFAN INSTITUTE   (Slovenia)

^c WROCLAW UNIVERSITY OF TECHNOLOGY   (Poland)

^d VIENNA UNIVERSITY OF TECHNOLOGY   (Austria)

Author keywords

Pressure sensor and force sensor; Sensor; Strain gauge; Thick film resistor

Indexed keywords

ALUMINA; ALUMINUM OXIDE; MICROELECTRONICS; PRESSURE SENSORS; RESISTORS; SENSORS; STRAIN GAGES; SUBSTRATES; THICK FILMS; ZIRCONIA;

ALUMINA SUBSTRATES; DIFFERENT SUBSTRATES; FORCE SENSOR; TEMPERATURE COEFFICIENT; TETRAGONAL ZIRCONIA; THICK FILM RESISTORS; THICK FILM SENSORS; THICK-FILM MATERIALS;

CHIP SCALE PACKAGES;

EID: 82755184642     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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