A low cost force sensor for an electronic scale

Informacije MIDEM

Volumn 27, Issue 3, 1997, Pages 172-176

  Belavič, Darko ^a,b   Šoba, Stojan ^a,c   Hodnik, Marjan ^a,c   Pavlin, Marko ^a,c   Gramc, Slavko ^a,c   Hrovat, Marko ^b  

^a HIPOT   (Slovenia)

^b JO EF STEFAN INSTITUTE   (Slovenia)

^c doo   (Slovenia)

Author keywords

Double bending beams; Electronic scales; Kitchen scales; Low cost; Microcontrollers; Piezoresistivity; Signal processing; Spring elements; Thick film resistors; Thick film sensors; Thick film strain gauges; Thick film technologies; Wheatstone bridges

Indexed keywords

EID: 3042890075     PISSN: 03529045     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (6)

1. M. Prudenziati, B. Morten, "Piezoresistive properties of thick film resistors - an overview", Hybrid Circuits, 10, May 1986, 20-23
2. M. Hrovat, D. Belavič, J. Holc, S. Šoba, "An evaluation of some commercial thick film resistors for strain gauges", J. Mater. Sci. Lett., 13, (1994), 992-995
3. M. Hrovat, G. Dražič, J. Holc, D. Belavič, "Microstructural investigation of thick film resistors for strain sensor applications by TEM", Proc. 22st Int. Conf. Microelectronics MIEL-94 / 30th Symp. on Devices and Materials SD-94, Terme Zreče-Rogla, 1994, 207-212
4. M. Hrovat, J. Holc, D. Belavič, S. Šoba, "A possible way to increase the gauge factors of thick film resistors", J. Mater. Sci. Lett., 14, (8), (1995), 584-586
5. M. Hrovat, G. Dražič, J. Holc, D. Belavič, "Correlation between microstructure and gauge factors of thick film resistors", J. Mater. Sci. Lett., 14, (15), (1995), 1048-1051
6. D. Belavič, S. Šoba, M. Pavlin, S. Gramc, D. Ročak, "Packaging technologies for thick film sensors", IMAPS/NATO Advanced Research Workshop on Electronic packaging for high reliability, low cost electronics, May 10-13, 1997, Bled