Thick film on stainless steel circuit board

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3906, Issue , 1999, Pages 106-111

  Ellis, M Ed ^a  

^a DELPHI CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; CERAMIC MATERIALS; ELECTRIC INSULATORS; HEAT SINKS; HYBRID INTEGRATED CIRCUITS; STAINLESS STEEL; SUBSTRATES;

CERAMIC HYBRID CIRCUIT; INTERFACE DIELECTRIC METHODS; LOW TEMPERATURE COFIRED CERAMICS; STAINLESS STEEL CIRCUIT BOARD;

THICK FILMS;

EID: 0033326131     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (1)