A novel hybrid packaging structure for high-temperature SiC power modules

IEEE Energy Conversion Congress and Exposition: Energy Conversion Innovation for a Clean Energy Future, ECCE 2011, Proceedings

Volumn , Issue , 2011, Pages 333-338

  Wang, Ruxi ^a   Chen, Zheng ^a   Boroyevich, Dushan ^a   Jiang, Li ^a   Yao, Yiying ^a   Kaushik, Rajashekara ^b  

^a VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY   (United States)

^b ROLLS ROYCE CORPORATION   (United States)

Author keywords

High Temperature Packaging; Hybrid Packaging Structure; Planar Packaging Structure; Silicon Carbide

Indexed keywords

FABRICATION PROCESS; HIGH TEMPERATURE; HIGH-TEMPERATURE PACKAGING; HYBRID PACKAGING STRUCTURE; HYBRID STRUCTURE; PACKAGING STRUCTURE; PARASITICS; PLANAR PACKAGING STRUCTURE; PLANAR STRUCTURE; POWER MODULE; WIREBOND;

ELECTRIC POWER SYSTEMS; ENERGY CONVERSION; FABRICATION; SILICON CARBIDE;

PACKAGING;

EID: 81855211043     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECCE.2011.6063788     Document Type: Conference Paper

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