Ultra-small compact transfer molded package for power modules

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 1832-1837

  Sano, Ko ^a   Hayashi, Kenichi ^a   Kawafuji, Hisashi ^a   Funakoshi, Nobuhito ^b  

^a MITSUBISHI ELECTRIC CORPORATION   (Japan)

^b Qual Eval and Chem Anal Dept   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ABS RESINS; COMPUTER NETWORKS; RESINS; THERMOELECTRICITY; THERMOSETS;

ELECTRONIC COMPONENTS; IN-LINE; INTELLIGENT POWER; PROTECTION CIRCUITS;

CONDUCTING POLYMERS;

EID: 51349083796     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550230     Document Type: Conference Paper

References (3)

1. S.Noda, K.H.Hussein, G.Majumdar, E.Thai, G.Debled, "A Novel Super Compact Intelligent Power Module", Proc. PowerConversion (June 1997), pp. 1-9
2. D.Nakajima, K.Tada, T.Sasaki, T.Shikano, Y.Kashiba, "High Thermal Dissipation Transfer Molded Package for Power Modules", Proc. 54th ECTC, IEEE (2004), pp.1825-1830.
3. E.Motto, J.Donlon, S.Shirakawa, T.Iwagami, H.Kawafuji, M.Seo, K.Satou, "Latest Progress in Power Modules for Appliance Inverter Applications", 41st IAS Annual Meeting, IEEE, Vol.3 (2006), pp.1222-1228.