SCOPUS 정보 검색 플랫폼

Volumn 21, Issue 38, 2011, Pages 14941-14947

Bimodal filler system consisting of mesoporous silica particles and silica nanoparticles toward efficient suppression of thermal expansion in silica/epoxy composites

(3) Suzuki, Norihiro a Kiba, Shosuke b Yamauchi, Yusuke a,c,d

a NATIONAL INSTITUTE FOR MATERIALS SCIENCE (Japan)

b Toyota Tsusho Corporation (Japan)

c JAPAN SCIENCE AND TECHNOLOGY AGENCY (Japan)

d WASEDA UNIVERSITY (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EPOXY RESINS; EXPANSION; FILLED POLYMERS; FILLERS; GLASS TRANSITION; MESOPOROUS MATERIALS; NANOPARTICLES; SILICA;

COEFFICIENT OF LINEAR THERMAL EXPANSION; CURING AGENTS; EPOXY POLYMERS; HIGHER TEMPERATURES; INORGANIC FILLERS; LOW THERMAL EXPANSION; MESO-PORES; MESOPOROUS SILICA PARTICLES; SILICA NANOPARTICLES; TEM OBSERVATIONS; THEORETICAL CALCULATIONS; THERMAL MECHANICAL ANALYSIS; WELL-DISPERSED;

THERMAL EXPANSION;

EID: 81855190800 PISSN: 09599428 EISSN: 13645501 Source Type: Journal
DOI: 10.1039/c1jm12405f Document Type: Article

Times cited : (42)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.