Prototype of low thermal expansion materials: Fabrication of mesoporous silica/polymer composites with densely filled polymer inside mesopore space

Chemistry - An Asian Journal

Volumn 5, Issue 9, 2010, Pages 2100-2105

  Kiba, Shosuke ^a   Suzuki, Norihiro ^b   Okawauchi, Yoshinori ^c   Yamauchi, Yusuke ^b,d,e  

^a Toyota Tsusho Corporation   (Japan)

^b NATIONAL INSTITUTE FOR MATERIALS SCIENCE   (Japan)

^c Admatechs Co Ltd   (Japan)

^d JAPAN SCIENCE AND TECHNOLOGY AGENCY   (Japan)

^e WASEDA UNIVERSITY   (Japan)

Author keywords

Composite; Mesoporous materials; Polymers; Silica; Thermal expansion materials

Indexed keywords

CAPILLARY FORCE; COEFFICIENT OF THERMAL EXPANSION; COMPOSITE; COMPOSITE PROCESSING; EPOXY POLYMERS; GLASS TRANSITION TEMPERATURE; LARGE PORES; LEAST SQUARE METHODS; LOW THERMAL EXPANSION MATERIALS; MESO-PORES; MESOPORE; MESOPOROUS; MESOPOROUS SILICA; MESOPOROUS SILICA PARTICLES; NEW MODEL; POLYMER MOBILITY; SILICA PARTICLES; THERMAL MECHANICAL ANALYSIS; THERMAL TREATMENT;

FILLED POLYMERS; GLASS TRANSITION; MATERIALS; MESOPOROUS MATERIALS; ORGANIC POLYMERS; SILICA; THERMAL STRESS;

THERMAL EXPANSION;

EID: 77956478205     PISSN: 18614728     EISSN: 1861471X     Source Type: Journal    
DOI: 10.1002/asia.201000202     Document Type: Article

References (25)

1. N. Kinjo, M. Ogata, K. Nishi, A. Kaneda, Adv. Polym. Sci. 1989, 88, 1.
2. L. B. D. Pavia, A. R. Morales, F. R. V. Diaz, Appl. Clay Sci. 2008,42, 8.
3. A. Scandurra, R. Zafarana, Y. Tenya, A. Yoshizumi, S. Pignataro, Euro Patent, EP1149864, 2001"Polymeric composition for packaging a semiconductor electronic device and packaging obtained therefrom".
4. A. Fujii, Proceedings of the 23th International Electronic Manufacturing Technology Symposium, Semicon South West, 1998.
5. A. Scandurra, R. Zafarana, Y. Tenya, S. Pignataro, Appl. Surf. Sci. 2004, 235, 65.
6. J. P. Yang, G. Yang, G. Xu, S. Y. Fu, Compos. Sci. Technol. 2007, 67, 2934.
7. L. B. Paiva, A. R. Morales, F. R. V. Díaz, Appl. Clay Sci. 2008, 42, 8.
8. C. K. Leong, D. D. L. Chung, Carbon 2003, 41, 2459.
9. R. Andrews, M. C. Weisenberger, Curr. Opin. Solid State Mater. Sci. 2004,8, 31.
10. P. J. F. Harris, Int. Mater. Rev. 2004, 49, 31.
11. C. Zhi, Y. Bando, T. Terao, C. Tang, H. Kuwahara, D. Golberg, Adv. Funct. Mater. 2009,19, 1857.
12. Z. K. Chen, J. P. Yang, Q. Q. Ni, S. Y. Fu, Y. G. Huang, Polymer 2009, 50, 4753.
13. T. Yanagisawa, T. Shimizu, K. Kuroda, C. Kato, Bull. Chem. Soc. Jpn. 1990,63, 988.
14. C. T. Kresge, M. E. Leonowicz, W. J. Roth, J. C. Vartuli, J. S. Beck, Nature 1992,359, 710.
15. S. Inagaki, Y. Fukushima, K. Kuroda, J. Chem. Soc. Chem. Commun. 1993, 680.
16. D. Y. Zhao, J. L. Feng, Q. S. Huo, N. Melosh, G. H. Fredrickson, B. F. Chmelka, G. D. Stucky, Science 1998,279, 548.
17. Y. Wan, D. Zhao, Chem. Rev. 2007,107, 2821.
18. C. K. Min, T. B. Wu, W. T. Yang, C. L. Chen, Compos. Sci. Technol. 2008,68, 1570.
19. J. Lin, X. Wang, Polymer 2007,48, 318.
20. T. Lee, S. S. Park, Y. Jung, S. Han, D. Han, I. Kim, C. S. Ha, Eur. Polym. J. 2009,45, 19.
21. S. Kiba, Y. Okawauchi, T. Yanagihara, M. Murakami, T. Shimizu, Y. Yamauchi, Chem. Asian J. 2009,4, 1798.
22. J. Jiao, X. Sun, T. J. Pinnavaia, Polymer 2009,50, 983.
23. T. J. Pinnavaia, US Patent 20100029832, 2008, "Composites comprising polymer and mesoporous silicate".
24. Y. W. Chen-Yang, C. W. Chen, Y. Z. Wu, Y. C. Chen, Electrochem. Solid-State Lett. 2005, 8, F1.
25. A. Shimojima, D. Mochizuki, K. Kuroda, Chem. Mater. 2001,13, 3603.