Effect of filler concentration of rubbery shear and bulk modulus of molding compounds

Microelectronics Reliability

Volumn 47, Issue 2-3, 2007, Pages 233-239

  Yang, D G ^a   Jansen, K M B ^a   Ernst, L J ^a   Zhang, G Q ^a,b   Bressers, H J L ^c   Janssen, J H J ^c  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b PHILIPS RESEARCH LABORATORIES   (Netherlands)

^c NXP SEMICONDUCTORS   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

DYNAMIC MECHANICAL ANALYSIS; ELASTIC MODULI; ELECTRONICS INDUSTRY; ELECTRONICS PACKAGING; EPOXY RESINS; PLASTIC ADHESIVES; PLASTICS FILLERS; RESIDUAL STRESSES; SHRINKAGE; SILICA;

ELECTRONIC COMPONENTS; FILLER CONCENTRATION; ROOM TEMPERATURE;

SHEET MOLDING COMPOUNDS;

EID: 33846584606     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2006.09.031     Document Type: Article

References (12)

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