A novel aluminum-filled composite dielectric for embedded passive applications

IEEE Transactions on Advanced Packaging

Volumn 29, Issue 2, 2006, Pages 295-306

  Xu, Jianwen ^a   Moon, Kyoung Sik ^a   Tison, Christopher ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Bimodal composites; Capacitors; Dielectric material; Embedded passives; Self passivation

Indexed keywords

ALUMINUM; CAPACITORS; COMPOSITE MATERIALS; DIELECTRIC PROPERTIES OF SOLIDS; FILLER METALS; PASSIVATION; PERMITTIVITY MEASUREMENT; RHEOLOGY; THERMOGRAVIMETRIC ANALYSIS; TRANSMISSION ELECTRON MICROSCOPY; VISCOSITY; VOLUME FRACTION;

ALUMINUM-FILLED COMPOSITE; BIMODAL COMPOSITES; EMBEDDED PASSIVES; MAXIMUM PACKING FRACTION; SELF-PASSIVATION;

DIELECTRIC MATERIALS;

EID: 33646574255     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/tadvp.2006.874701     Document Type: Article

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