Technologies for exascale systems

IBM Journal of Research and Development

Volumn 55, Issue 5, 2011, Pages

  Coteus, P W ^a   Knickerbocker, J U ^a   Lam, C H ^a   Vlasov, Y A ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BANDWIDTH COMMUNICATION; BUSINESS APPLICATIONS; CLOSE PROXIMITY; DIE STACK; EFFICIENT POWER; ELECTRICAL DEMAND; HIGH BANDWIDTH; LIQUID COOLING; LOCAL INTERCONNECTS; LOW POWER; MEMORY TECHNOLOGY; POWER CONSTRAINTS; SILICON INTEGRATION; SYSTEM ON A CHIP;

BANDWIDTH; ELECTRIC POWER TRANSMISSION; INTEGRATION; NANOPHOTONICS; OPTICAL INTERCONNECTS; TELECOMMUNICATION SYSTEMS;

TECHNOLOGY;

EID: 81555199698     PISSN: 00188646     EISSN: 21518556     Source Type: Journal    
DOI: 10.1147/JRD.2011.2163967     Document Type: Article

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