Low cost wafer level packaging of MEMS devices [piezoresistive pressure sensor example]

Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003

Volumn , Issue , 2003, Pages 287-290

  Iliescu, C ^a   Miao, Jianmin ^b   Tay, F E H ^a,c  

^a INSTITUTE OF BIOENGINEERING AND NANOTECHNOLOGY   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^c NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

GLASS BONDING; PACKAGING MATERIALS; PRESSURE SENSORS; SEALING (CLOSING); SILICON WAFERS; WAFER BONDING;

MECHANICAL CONNECTIONS; OPERATING RANGES; PACKAGING SOLUTIONS; PACKAGING TECHNIQUES; PIEZORESISTIVE PRESSURE SENSORS; SUPPLY VOLTAGES; WAFER LEVEL PACKAGING; WAFER TO WAFER BONDING;

ELECTRONICS PACKAGING;

EID: 81355140311     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2003.1271530     Document Type: Conference Paper

References (10)

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