Chip-size-packaged silicon microphones

Sensors and Actuators, A: Physical

Volumn 92, Issue 1-3, 2001, Pages 23-29

  Mullenborn M ^a   Rombach, P ^a   Klein, U ^a   Rasmussen, K ^a   Kuhmann, J F ^a   Heschel, M ^a   Gravad, M Amskov ^b   Janting, J ^b   Branebjerg, J ^b   Hoogerwerf, A C ^c   Bouwstra, S ^d  

^a TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

^b DELTA Danish Electronics Light & Acoustics   (Denmark)

^c CSEM   (Switzerland)

^d Microcosm Technologies BV   (Netherlands)

Author keywords

Acoustic transducers; Microphone; Packaging; Stacking

Indexed keywords

ACOUSTIC TRANSDUCERS; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT LAYOUT; SEMICONDUCTING SILICON; SPURIOUS SIGNAL NOISE;

CHIP STACK; SILICON MICROPHONES; WIRE BONDING;

MICROPHONES;

EID: 0035426231     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(01)00535-0     Document Type: Article

References (11)

1. A review of silicon microphones
2. Micromachined double backplate differential capacitive microphone
3. Capacitive microphone with low-stress polysilicon membrane and high-stress polysilicon backplate
4. A high sensitivity polysilicon diaphragm condenser microphone
5. A low-voltage silicon condenser microphone for hearing instrument applications
6. Silicon micromachined microphone chip at Siemens
7. Through wafer interconnects and flip-chip bonding: A toolbox for advanced hybrid technologies for MEMS
8. Silicon-to-silicon wafer bonding using evaporated glass
9. Acoustics
10. Stacked silicon microphones