Disk-shaped bulk micromachined gyroscope with vacuum sealing

Sensors and Actuators, A: Physical

Volumn 82, Issue 1, 2000, Pages 198-204

  Fujita, T ^a   Maenaka, K ^a   Mizuno, T ^a   Matsuoka, T ^a   Kojima, T ^a   Oshima, T ^a   Maeda, M ^a  

^a UNIVERSITY OF HYOGO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

APPLICATION SPECIFIC INTEGRATED CIRCUITS; MICROMACHINING; SEMICONDUCTING GLASS; SENSORS; SILICON WAFERS; VACUUM TECHNOLOGY;

VACUUM SEALING;

GYROSCOPES;

EID: 0033741541     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(99)00370-2     Document Type: Article

References (7)

1. Yazdi N., Ayazi F., Najafi K. Micromachined inertial sensors. Proc. IEEE. 86(8):1998;1640-1659.
2. Song C., Shinn M. Commercial vision of silicon-based inertial sensors. Sensors and Actuators A. 66:1998;231-236.
3. Juneau T., Pisano A.P., Smith J.H. Dual-axis operation of a micromachined rate gyroscope. Dig. Tech. Pap. IEEE Int Conf. Solid-State Sens. Actuators. 1998;883-886.
4. Geiger W., Folkmer B., Merz J., Sandmaier H., Lang W. A new silicon rate gyroscope. Proc. IEEE Micro Electro Mechanical Systems Workshop (MEMS '98). 1998;615-620.
5. Maenaka K., Fujita T., Konishi Y., Maeda M. Analysis of a highly sensitive silicon gyroscope with cantilever beam as vibrating mass. Sensors and Actuators A. 54:1996;568-573.
6. Okamoto K., Asada K., Fujita T., Maenaka K., Maeda M. Evaluation of ASIC characteristics for silicon gyroscopes, by using multi-chip service. Tech. Dig. 16th Sens. Symp. 1998;245-248.
7. Sugiyama S. Scope for micromachining multi-project chip service in Japan. Tech. Dig. 14th Sens. Symp. 1996;15-18.