Preparation of CuO nanoparticles by metal salt-base reaction in aqueous solution and their metallic bonding property

Journal of Nanoparticle Research

Volumn 13, Issue 10, 2011, Pages 5365-5372

  Kobayashi, Y ^a   Maeda, T ^a   Watanabe, K ^a   Ihara, K ^a   Yasuda, Y ^b   Morita, T ^b  

^a IBARAKI UNIVERSITY   (Japan)

^b HITACHI LTD   (Japan)

Author keywords

Aggregate; Bonding; Colloid; Copper oxide; Nanoparticle; Synthesis

Indexed keywords

AVERAGE SIZE; COLLOID SOLUTIONS; CUO NANOPARTICLES; METALLIC BONDING; METALLIC COPPER; REACTION TEMPERATURE;

AGGLOMERATION; AGGREGATES; COLLOID CHEMISTRY; COLLOIDS; NANOPARTICLES; SHEAR STRENGTH; SOLUTIONS; SYNTHESIS (CHEMICAL);

COPPER OXIDES;

COPPER OXIDE; NANOPARTICLE;

AQUEOUS SOLUTION; ARTICLE; CHEMICAL REACTION; PARTICLE SIZE; PRIORITY JOURNAL; SHEAR STRENGTH; SYNTHESIS; WELDING;

EID: 80955158656     PISSN: 13880764     EISSN: 1572896X     Source Type: Journal    
DOI: 10.1007/s11051-011-0522-9     Document Type: Article

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