Three-dimensional global interconnect based on a design window

Chinese Physics B

Volumn 20, Issue 10, 2011, Pages

  Qian, Li Bo ^a   Zhu, Zhang Ming ^a   Yang, Yin Tang ^a  

^a XIDIAN UNIVERSITY   (China)

Author keywords

bandwidth; design window; three dimensional integrated circuit; wiring resource

Indexed keywords

DESIGN-RELIABILITY; DISTRIBUTED MODELS; GLOBAL INTERCONNECTS; INTEGRATED CIRCUIT DESIGNS; SYSTEM-ON-CHIP; TECHNOLOGY NODES; THREE DIMENSIONAL INTEGRATED CIRCUITS; WIRE LENGTH;

APPLICATION SPECIFIC INTEGRATED CIRCUITS; BANDWIDTH; DESIGN; INTEGRATED CIRCUIT MANUFACTURE; INTEGRATED CIRCUITS; INTEGRATION; INTERCONNECTION NETWORKS; PROGRAMMABLE LOGIC CONTROLLERS; STOCHASTIC MODELS;

THREE DIMENSIONAL;

EID: 80053952257     PISSN: 16741056     EISSN: None     Source Type: Journal    
DOI: 10.1088/1674-1056/20/10/108401     Document Type: Article

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