Evaluation of the waterproof ability of a hydrophobic nickel micromesh with array-type microholes

Journal of Micromechanics and Microengineering

Volumn 19, Issue 12, 2009, Pages

  Lee, Sang Min ^a   Oh, Dong Joon ^a   Jung, Im Deok ^a   Jung, Phill Gu ^a   Chung, Kwang Hyo ^b   Jang, Won Ick ^b   Ko, Jong Soo ^a  

^a Pusan National University   (South Korea)

^b Electronics and Telecommunications Research Institute (ETRI)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CONTACT ANGLE; ELECTROFORMING; HYDRAULIC FLUIDS; HYDROPHOBICITY;

CIRCULAR HOLES; COATED FILMS; HOLE DIAMETER; HYDRAULIC PRESSURE; NICKEL ELECTROFORMING; PLASMA-POLYMERIZED FLUOROCARBONS; WATER HEIGHTS; WATERPROOF PERFORMANCE;

WATERPROOFING;

EID: 80053595438     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/19/12/125024     Document Type: Article

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