Using a helical micro-tool in micro-EDM combined with ultrasonic vibration for micro-hole machining

Journal of Micromechanics and Microengineering

Volumn 16, Issue 12, 2006, Pages 2705-2713

  Hung, Jung Chou ^a   Lin, Jui Kuan ^b   Yan, Biing Hwa ^a   Liu, Hung Sung ^a   Ho, Ping Hsing ^a  

^a NATIONAL CENTRAL UNIVERSITY   (Taiwan)

^b INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; ELECTRODES; GRINDING (MACHINING); MEASUREMENT THEORY; NICKEL ALLOYS; SCANNING ELECTRON MICROSCOPY; ULTRASONICS; VIBRATIONS (MECHANICAL);

HELICAL ELECTRODES; MICRO-HOLES; ULTRASONIC VIBRATION; WIRE ELECTRO-DISCHARGE GRINDING (WEDG);

MACHINING;

EID: 33846101048     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/16/12/025     Document Type: Article

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