Multistage planar thermoelectric microcoolers

Journal of Microelectromechanical Systems

Volumn 20, Issue 5, 2011, Pages 1201-1210

  Gross, Andrew J ^a,b   Hwang, Gi Suk ^a,c   Huang, Baoling ^a,d   Yang, Hengxi ^a   Ghafouri, Niloufar ^a   Kim, Hanseup ^a,e   Peterson, Rebecca L ^a   Uher, Ctirad ^a   Kaviany, Massoud ^a,f   Najafi, Khalil ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

^b SANDIA NATIONAL LABORATORIES   (United States)

^c LAWRENCE BERKELEY NATIONAL LABORATORY   (United States)

^d HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

^e UNIVERSITY OF UTAH   (United States)

^f Pohang University of Science and Technology (POSTECH)   (South Korea)

Author keywords

Microcooler; microelectromechanical systems (MEMS); solid state cooling; thermoelectric (TE) devices

Indexed keywords

INTEGRATED COOLING SOLUTION; LOW-POWER OPERATION; LOWER-POWER CONSUMPTION; MEMS APPLICATIONS; MICROCOOLERS; MICROELECTROMECHANICAL SYSTEMS (MEMS); P-TYPE; PERFORMANCE CHARACTERISTICS; PLANAR CONFIGURATIONS; ROOM TEMPERATURE; SOLID-STATE COOLING; THERMOELECTRIC (TE) DEVICES; THERMOELECTRIC MICROCOOLERS;

MECHATRONICS; MEMS; MICROELECTROMECHANICAL DEVICES; MICROMECHANICS; MICROSYSTEMS; THERMOELECTRIC EQUIPMENT;

COOLING SYSTEMS;

EID: 80053566631     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2011.2163302     Document Type: Article

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