Lab-on-CMOS: Integrating microfluidics and electrochemical sensor on CMOS

NEMS 2011 - 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems

Volumn , Issue , 2011, Pages 690-693

  Huang, Yue ^a   Mason, Andrew J ^a  

^a Michigan State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BATCH PRODUCTION; CARRIER CHIP; CMOS CHIPS; CROSS OVER; DETECTION CHANNELS; HIGH PACKING DENSITY; INTEGRATION PROCESS; LAB-ON-CHIP; LAB-ON-CHIP DEVICES; MICROFLUIDIC CHANNEL; MICROFLUIDIC MIXERS; MICROFLUIDIC STRUCTURES; PERFORMANCE BENEFITS; PLANAR SURFACE; SMOOTH SURFACE;

CMOS INTEGRATED CIRCUITS; FLUIDIC DEVICES; LABORATORIES; SENSORS;

MICROFLUIDICS;

EID: 80053325407     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/NEMS.2011.6017448     Document Type: Conference Paper

References (9)

1. S. Joo and R. B. Brown, "Chemical Sensors with Integrated Electronics," Chemical Reviews, vol. 108, pp. 638-651, 2008. (Pubitemid 351350389)
2. E. Ghafar-Zadeh et al., "A direct-write microfluidic fabrication process for CMOS-based Lab-on-Chip applications", Microelectronic Engineering, vol. 86, no. 10, p. 2104-2109, 2009.
3. U. Frey, J. Sedivy, F. Heer, R. Pedron, M. Ballini, J. Mueller, D. Bakkum, S. Hafizovic, F. D. Faraci, F. Greve, K. U. Kirstein, and A. Hierlemann, "Switch-Matrix-Based High-Density Microelectrode Array in CMOS Technology," Solid-State Circuits, IEEE Journal of, vol. 45, pp. 467-482, 2010
4. L.S. Jang, C.C. Wu, and C.F. Liu, "Fabrication of microfluidic devices for packaging CMOS MEMS impedance sensors," Microfluidics and Nanofluidics, vol. 7, pp. 869-875, 2009.
5. W. Li, D. C. Rodger, and Y. C. Tai, "Implantable RF-coiled chip packaging," presented at Micro Electro Mechanical Systems, 2008. MEMS 2008. IEEE 21st International Conference on, 2008.
6. K C Tang, E Liao, W L Ong, J D S Wong, A Agarwal, R Nagarajan and L Yobas, "Evaluation of bonding between oxygen plasma treated polydimethyl siloxane and passivated silicon," Journal of Physics: Conference Series, vol 34, pp. 155-161, 2006. (Pubitemid 43812419)
7. A. J. G. Strandjord, S. Popelar, C. Jauernig, "Interconnecting to aluminum- and copper-based semiconductors (electroless-nickel/gold for solder bumping and wire bonding)," Microelectronics Reliability, vol. 42, pp. 265-283, 2002. (Pubitemid 34182188)
8. M, Datta, S.A. Merritt, M. Dagenais, "Electroless remetallization of aluminum bond pads on CMOS driver chip for flip-chip attachment to vertical cavity surface emitting lasers (VCSEL's)," Components and Packaging Technologies, IEEE Transactions on, vol.22, no.2, pp.299-306, 1999. (Pubitemid 30559382)
9. C. Yang, Y. Huang, B. L. Hassler, R.M. Worden, A. J. Mason, "Amperometric Electrochemical Microsystem for a Miniaturized Protein Biosensor Array," IEEE Trans. Biomedical Circ. Systems, vol. 3, no. 3, pp. 160-168, 2009.