Microstructural evolution in pure copper severely deformed by the ARB process

Materials Science Forum

Volumn 503-504, Issue , 2006, Pages 615-620

  Li, B L ^a   Shigeiri, N ^a   Tsuji, N ^a   Minamino, Y ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

ARB process; Grain subdivision; Microstructure; Pure copper

Indexed keywords

ALUMINUM COMPOUNDS; COPPER COMPOUNDS; CRYSTALLIZATION; DEFORMATION; ELECTRIC CONDUCTIVITY; FERRITIC STEEL; LUBRICATION; OXYGEN; TRANSMISSION ELECTRON MICROSCOPY;

ACCUMULATIVE ROLL-BONDING (ARB) PROCESS; ADIABATIC HEATING; HIGH ANGLE BOUNDARIES (HAB); HIGH ANGLE LAMELLAR BOUNDARY; LOW ANGLE BOUNDARIES (LAB); OXYGEN FREE HIGH CONDUCTIVITY (OFHC);

MICROSTRUCTURAL EVOLUTION;

EID: 34548013589     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/0-87849-985-7.615     Document Type: Conference Paper

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