Evaluation of texture and grain size of nanograined copper produced by the accumulative roll bonding process

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 40, Issue 7, 2009, Pages 1693-1700

  Shaarbaf, Mahnoosh ^a   Toroghinejad, Mohammad Reza ^a  

^a ISFAHAN UNIVERSITY OF TECHNOLOGY   (Iran)

Author keywords

[No Author keywords available]

Indexed keywords

ACCUMULATIVE ROLL BONDING; AMBIENT TEMPERATURES; CUBE TEXTURE; GRAIN SIZE; PREFERENTIAL GROWTH; PURE COPPER; RECRYSTALLIZATION TEXTURE; SHEAR TEXTURE; SUBSURFACE REGIONS; TEXTURE ANALYSIS; WILLIAMSON-HALL; XRD PATTERNS;

COPPER; GEOMETRY; GRAIN SIZE AND SHAPE; ROLL BONDING; X RAY DIFFRACTION; X RAY DIFFRACTION ANALYSIS;

TEXTURES;

EID: 67650520095     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-009-9851-z     Document Type: Article

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