Nucleation and thickening of shear bands in nano-scale twin/matrix lamellae of a Cu-Al alloy processed by dynamic plastic deformation

Acta Materialia

Volumn 58, Issue 8, 2010, Pages 3103-3116

  Hong, C S ^a   Tao, N R ^a   Huang, X ^b   Lu, K ^a  

^a INSTITUTE OF METAL RESEARCH   (China)

^b TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

Author keywords

Dislocation structure; Dynamic plastic deformation; Nano grained structure; Nano scale twins; Shear bands

Indexed keywords

CONSTANT THICKNESS; CORE REGION; CU-AL ALLOYS; DETWINNING; DISLOCATION STRUCTURES; DYNAMIC PLASTIC DEFORMATION; GRAIN SIZE; GRAIN STRUCTURES; HIGH DENSITY; HIGH-RESOLUTION TEM; INTERFACE BOUNDARIES; LAMELLAR THICKNESS; LARGE SHEAR; LOCALIZED DEFORMATIONS; NANO SCALE; NANO-SCALE TWINS; NANO-SIZED; NANOGRAINED STRUCTURE; NARROW BANDS; NUCLEATION PROCESS; NUCLEATION STAGES; SHEAR BANDING; STRAIN GRADIENTS; TEM; TRANSITION LAYERS; TWO-STAGE PROCESS;

BENDING (DEFORMATION); COPPER ALLOYS; GRAIN SIZE AND SHAPE; HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; NANOSTRUCTURED MATERIALS; NUCLEATION; PLASTIC DEFORMATION; PLASTICS; SCANNING ELECTRON MICROSCOPY; SHEAR STRAIN;

SHEAR BANDS;

EID: 77949541822     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2010.01.049     Document Type: Article

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