Thermal residual stresses in adhesively bonded in-plane functionally graded clamped plates subjected to an edge heat flux

Journal of Adhesion Science and Technology

Volumn 25, Issue 15, 2011, Pages 1861-1908

  Apalak, M Kemal ^a   Bagci, M Didem ^a  

^a ERCIYES UNIVERSITY   (Turkey)

Author keywords

adhesive joint; clamped plate; finite difference method; Functionally graded material; thermal residual stress; thermo elasticity

Indexed keywords

ADHESIVE LAYERS; ADHESIVE STRESS; ADHESIVE THICKNESS; CLAMPED PLATES; COMPOSITIONAL GRADIENTS; CONSTANT HEAT FLUX; EQUIVALENT STRAINS; EQUIVALENT STRESS; FREE EDGE; FUNCTIONALLY GRADED; FUNCTIONALLY GRADED PLATES; IN-PLANE; IN-PLANE DIRECTION; LARGE REGIONS; MATERIAL COMPOSITIONS; MATERIAL PROPERTY; NAVIER EQUATIONS; NORMAL STRAIN; OVERLAP LENGTH; PLATE CONFIGURATION; PLATE THICKNESS; POWER LAW; SINGULAR VALUE METHOD; STRESS AND STRAIN; STRESS LEVELS; TEMPERATURE LEVEL; TEMPERATURE PROFILES; THERMAL RESIDUAL STRESS; TRANSFER PERIOD; TRANSIENT HEAT CONDUCTION; VOLUMETRIC DEFORMATION;

ADHESIVE JOINTS; ADHESIVES; BEAMS AND GIRDERS; DEFORMATION; ELASTICITY; FINITE DIFFERENCE METHOD; FUNCTIONALLY GRADED MATERIALS; HEAT TRANSFER; INTERFACES (MATERIALS); MATERIALS PROPERTIES; PLATES (STRUCTURAL COMPONENTS); RESIDUAL STRESSES; SOLDERED JOINTS; STRAIN; STRUCTURAL DESIGN; THERMOELASTICITY;

HEAT FLUX;

EID: 80052304942     PISSN: 01694243     EISSN: 15685616     Source Type: Journal    
DOI: 10.1163/016942410X525768     Document Type: Article

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