Vacuum microsystems for energy conversion and other applications

2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11

Volumn , Issue , 2011, Pages 7-11

  Howe, Roger T ^a  

^a Stanford University   (United States)

Author keywords

photon enhanced thermionic energy converter; solar electricity generation; thermionic energy converter; THz sources; vacuum microelectronics; Vacuum microencapsulation

Indexed keywords

SOLAR ELECTRICITY; THERMIONIC ENERGY CONVERTER; THERMIONIC ENERGY CONVERTERS; THZ SOURCES; VACUUM MICROELECTRONICS;

ACTUATORS; ELECTRIC GENERATORS; ENCAPSULATION; ENERGY CONVERSION; FREQUENCY BANDS; MICROELECTRONICS; MICROSYSTEMS; PHOTONS; SILICON WAFERS; SOLID-STATE SENSORS; VACUUM; VACUUM TECHNOLOGY; VACUUM TRANSDUCERS;

VACUUM APPLICATIONS;

EID: 80052109507     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/TRANSDUCERS.2011.5969896     Document Type: Conference Paper

References (34)

1. S. J. Cunningham and M. Kupnik, "Wafer Bonding," in R. Ghodssi and P. Lin, eds., Handbook of MEMS Materials and Processes, Springer, 2010.
2. B. T. Khuri-Yakub, Ö. Oralkan, and M. Kupnik, IEEE Spectrum 46, 44-54 (2009).
3. H. Guckel and D.W. Burns, IEEE Int. Electron Devices Meeting, 223-225, San Francisco, Dec. 1984.
4. C. H. Mastrangelo and R.S. Muller, IEEE Int. Electron Devices Meeting, 503-506, Washington, Dec. 1989.
5. K. Iketa, et al, Sensors and Actuators A, 23, 1007-1010, (1990).
6. A. Partridge, A. E. Rice, T. W. Kenny, and M. Lutz, IEEE MEMS Conf., 54-59, Interlaken, Jan. 2001.
7. R. N. Candler, et al, JMEMS, 15, 1446-1456, (2006).
8. K. S. Lebouitz, et al, IEEE MEMS Conf., 470-475, Orlando, Jan. 1999.
9. R. Kant, et al, Electrochem. Solid State Lett., 12, H437-H440 (2009).
10. R. Kant, H. Choo, and R. T. Howe, Int. Conf. Eletron, Ion, Photon Beam Tech. Nanofab., Anchorage, Alaska, June 2010.
11. M. W. Messana, et al, Solid State Sensor, Actuator, and Microsys. Workshop, Hilton Head, June 2010.
12. A. B. Graham, Ph.D. Thesis, Dept. of Mechanical Engineering, Stanford University, Aug. 2010.
13. S. Sedky, et al, IEEE MEMS Conf., 276-279, Cancun, Jan. 2011.
14. W. Schlichter, Ann. Physik, 47, 573-640 (1915).
15. M. Y. Gurtovoy and G. I. Kovalenko, Fizichni Zapiski, 9, 240 (1941).
16. K. G. Hernqvist, F. Kanefsky, and F. H. Norman, RCA Review, 19, 244-258 (1958).
17. D. B. King, et al, 35th Intersociety Energy Conv. Eng. Conf. and Ex., 272-282, Las Vegas, July 2000.
18. D. B. King, et al, "Microminiature Thermionic Converters," U.S. Patent 6,509,669, Jan. 21, 2003.
19. C. Zhang, et al, 12th Int. Conf. Solid-State Sens., Acts. and Microsys., Transducers '03, 40-44, Boston, June 2003.
20. F. A. M. Koeck, et al, Diamond Related Materials, 18, 789-791 (2009).
21. W. F. Paxton, et al, Int. Conf. Vac. Nanoelectronics, 49-50, Palo Alto, July 2010.
22. L.-A. Liew, J. Moreland, and V. Girgenov, Appl. Phys. Lett., 90, 114106 (2007).
23. F. Liu, et al, J. Micromech. Microeng., 20, 035011 (2010).
24. S. Yoneoka, et al, JMEMS, 19, 357-366, (2010).
25. J.-H. Lee, et al, this conference.
26. F. Liu, et al, Appl. Phys. Lett., 97, 262107 (2010).
27. J. W. Schwede, et al, Nature Materials, 10, 762-767 (2010).
28. K. Nakayama, et al, Appl. Phys. Lett., 93, 12194 (2008).
29. J. Zhu, et al, Nano Lett., 10, 1979-1984 (2010).
30. P. H. Siegel, et al, 12th Int. Symp. Space THz Tech., San Diego, Feb. 2001.
31. H. M. Manohara, et al, J. Infrared Milli. TeraHz Waves, 30, 1338-1350 (2009).
32. H. Barkhausen and K. Kurz, Physik. Zeit. 21, 1-6 (1920).
33. E. M. Boone, M. Uenohara, and D. T. Davis, IRE Trans. Electron Dev., 5, 196-205 (1958).
34. J. P. Snapp, Ph.D. Thesis, Dept. of Electrical Engineering, Stanford University, Aug. 2011 (expected).