Overview of recent advances on isotropic conductive adhesives

2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06

Volumn , Issue , 2006, Pages 218-227

  Lu, Daoqiang Daniel ^a   Wong, C P ^b  

^a INTEL CORPORATION   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 34250817596     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/hdp.2006.1707596     Document Type: Conference Paper

References (52)

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